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TC 5688 Thermally Conductive Compound 3g 8.0w mK
SKU: CO395
| Brand / Compatible with: Dow Corning
$19.99
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(Usually ships within 24 hours)
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Product Description
Dow Corning®TC-5688 Thermally Conductive Compound was developed exclusively for Intel microprocessors in collaboration with the Intel Mobile Platforms Group. TC-5688 was developed and optimized for multi-chip packages and employs a proprietary formula of advanced silicone polymers that interacts with thermally conductive filler particles to form a matrix that is highly resistant to pump-out and other common failure mechanisms. The result is a thermal compound that delivers extreme performance and exceptional reliability for the thermal interface needs.
- Low thermal resistance for superior heat transfer, 0.061cm²C/W @40 PSI
- Thin bond line for hi-efficiency conductivity
- Enhance cooling performance
- Non pressure dependent
- Multi-language instructions included
- RoHS compliant
- AMD recommended
Companies like Nvidia, Apple, Google, AMD, Intel, NASA, IBM, HP, Boeing, etc. are buying these Dow Corning and Shin-Etsu products from us!
Specifications
- Colour: Grey
- Thermal conductivity: 8.0W/mK
- Operating temperature: -50°C ~ 400°C
- Volume: >3g
- Product code: TC 5688
Keywords: Dow Corning TC 5688 in Syringe, tc5688, TC 5688 Thermally Conductive Compound 3g 8.0w mK
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