Laird Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures. Tflex 300-H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liner lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis.
Features and Benefits
Typical Properties
Thermal Properties
Enjoyed my experience, useful products
"Enjoyed my experience, useful products"
Ordered what I needed, it came like it was suppose...
"Ordered what I needed, it came like it was supposed to, easy to follow tracking. I now have the ptm7950 on my 7900xtx and I'm happy with the results."
The chat bot its a little bit to invasive.
"The chat bot its a little bit to invasive."
Great products with very easy ordering. I received...
"Great products with very easy ordering. I received word, though, that the product had arrived a week ago and it just appeared in my mailbox. Better late then never, but I was certain it had been stolen."
na
"na"
Carrie helped me so much with my order. She was really great. :D
"Carrie helped me so much with my order. She was really great. :D"
Easy to find the right cables
"Easy to find the right cables"
Fast, loved the international shipping offer
"Fast, loved the international shipping offer"
<3
"<3"
Easy
"Easy"