Shin-Etsu MicroSi Thermal Interface Material X23-8195-4 (3g)
Shin-Etsu Silicone Thermal Grease: This silicone fluid compound contains thermally-conductive fillers. With a high thermal conductivity value, this product emphasizes high bulk thermal conductivity values and ease of workability. The smaller diameter filler allows the material to achieve thinner bondlines. Ideally suited for CPU's and applications where mating surfaces have minimally uneven surfaces.
Syringe application: Shin-Etsu MicroSi's syringes are ideal for manual applications assuring that a consistent shot weight is applied to the intended surface. Shin-Etsu MicroSi's SQC processes provide a consistent dispense weight with each syringe.
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Excellent overall. Third order from the company.
"Excellent overall. Third order from the company."
all good
"all good"
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Shipping is a little slow, but I am sure the cable...
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Excellent
"Excellent"
Great people, great products !
"Great people, great products !"
I give you 5 stars for the site and info but lets see how good is the cable :))
"I give you 5 stars for the site and info but lets see how good is the cable :))"
Easy and fast
"Easy and fast"