Thermal Interface Material X23 7868 2D 6.2W mK

Shin-Etsu MicroSi Thermal Interface Material X-23-7868-2D (W/mK > 6.2)

X23-7868-2D, is a thermal interface material developed and manufactured by Shin-Etsu Chemical with ease of application in mind. Specifically formulated to include an application chemical to allow ease of screening and other application techniques. With a higher Thermal Conductivity coupled with lower Thermal Resistance exceeds thermal management requirements of high-performance semiconductor devices. Through superior heat dissipation, the X23-7868-2D allows electronic devices to remain cooler and increases their long term reliability.

Free Shipping Worldwide

MADE IN JAPAN!

• Excellent thermal resistance (TR) and thermal conductivity (TC)
• Low viscosity at the time of application, easily applied via dispensing, stencil printing, or screen printing methods
• Stable homogeneous mixture for consistent thermal performance
• RoHS and REACH Compliant
• High volume production product from a proven industry leader Available worldwide through established supply chain networks

General Properties

• Syringes : 5G
• Color : Grey 
• Viscosity (Pa·s) (pre-flash) * : 100
• Viscosity (Pa·s) (post-flash) * : 680
• Thermal Resistance ***(mm2-K/W) : 5.0
• Thermal Conductivity **(W/m °K) (post-flash) : 6.2
• BLT (µm) (Thin—BLT) (20psi) : 30

Source: https://www.amd.com/en/support/kb/faq/cpu-0001