Shin Etsu MicroSi Thermal Interface Material X23 7783D 1KG

Shin-Etsu MicroSI X-23-7783D High-Performance Thermal Compound (1KG)

Shin-Etsu Silicone Thermal Grease: This silicone fluid compound contains thermally-conductive fillers. With a high thermal conductivity value, this product emphasizes high bulk thermal conductivity values and ease of workability. The smaller diameter filler allows the material to achieve thinner bond lines. Ideally suited for CPU's and applications where mating surfaces have minimally uneven surfaces. 

Syringe application: Shin-Etsu MicroSi's syringes are ideal for manual applications assuring that a consistent shot weight is applied to the intended surface. Shin-Etsu MicroSi's SQC processes provide a consistent dispense weight with each syringe. 

MADE IN JAPAN!

• Optimal efficiency and thermal transfer.
• Convenient syringe for easy application.
• High-performance thermal grease. Good for general applications. Especially on an uneven surface.
• Injector with cap for easy application and storage
• Thermal Conductivity: 6.0 (W/m K)
• Specific Gravity: 2.6
• Electrically non-conductive
• Viscosity: (Pa.s @ 25C) 250
• Storage Conditions 60F to 85F (15C - 29C)

Source: https://www.amd.com/en/support/kb/faq/cpu-0001