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Shin Etsu MicroSi Thermal Interface Material X23 7868 2D 5g

SKU: X23-7868-2D  |  Brand / Compatible with: Shin-Etsu MicroSi
Shin Etsu MicroSi Thermal Interface Material X23 7868 2D 6.2W mK
  • Shin Etsu MicroSi Thermal Interface Material X23 7868 2D 6.2W mK
  • Shin-Etsu MicroSi Thermal Interface Material X-23-7868-2D (W/mK > 6.2)
  • Shin-Etsu MicroSi Thermal Interface Material X-23-7868-2D (W/mK > 6.2)
  • Shin-Etsu MicroSi Thermal Interface Material X-23-7868-2D (W/mK > 6.2)
  • Shin-Etsu MicroSi Thermal Interface Material X-23-7868-2D (W/mK > 6.2)
  • Shin-Etsu MicroSi Thermal Interface Material X-23-7868-2D (W/mK > 6.2)
  • Shin-Etsu MicroSi Thermal Interface Material X-23-7868-2D (W/mK > 6.2)
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Product Description

Shin-Etsu MicroSi Thermal Interface Material X-23-7868-2D (W/mK > 6.2)

X23-7868-2D, is a thermal interface material developed and manufactured by Shin-Etsu Chemical with ease of application in mind. Specifically formulated to include an application chemical to allow ease of screening and other application techniques. With a higher Thermal Conductivity coupled with lower Thermal Resistance exceeds thermal management requirements of high-performance semiconductor devices. Through superior heat dissipation, the X23-7868-2D allows electronic devices to remain cooler and increases their long term reliability.

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MADE IN JAPAN!

  • Excellent thermal resistance (TR) and thermal conductivity (TC)
  • Low viscosity at the time of application, easily applied via dispensing, stencil printing, or screen printing methods
  • Stable homogeneous mixture for consistent thermal performance
  • RoHS and REACH Compliant
  • High volume production product from a proven industry leader Available worldwide through established supply chain networks

General Properties

  • Syringes : 5G
  • Color : Grey 
  • Viscosity (Pa·s) (pre-flash) * : 100
  • Viscosity (Pa·s) (post-flash) * : 680
  • Thermal Resistance ***(mm2-K/W) : 5.0
  • Thermal Conductivity **(W/m °K) (post-flash) : 6.2
  • BLT (µm) (Thin—BLT) (20psi) : 30

Companies like Nvidia, Apple, Google, AMD, Intel, Meta, Cisco, Tesla, IBM, HP, Boeing, HSBC, etc. are buying these Honeywell and Shin-Etsu products from us!

What type of thermal interface material does AMD recommend to be used with an AMD64 processor?

Source: https://www.amd.com/en/support/kb/faq/cpu-0001

Keywords: Shin Etsu X23 7868 2D in Syringe, Shin Etsu MicroSi Thermal Interface Material X23 7868 2D 5g
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  1. 22 Jan 2025

    Peter

    Found what i needed at a reasonable price . first ...

    "Found what i needed at a reasonable price . first time shopper . will return if i need to"

  2. 21 Jan 2025

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  3. 21 Jan 2025

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    Had the parts I needed to replace the fans on my graphics card

    "Had the parts I needed to replace the fans on my graphics card"

  4. 21 Jan 2025

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  1. 2022-12-05

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