Dow Corning DOWSIL TC-5888 5W Thermally Conductive Compound Grey (2g)
Gray, thixotropic, non-curing thermally conductive compound. Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of modules, including computer MPUs and power modules.
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Benefits
- One-Part Material: No cure is required when applying the material.
- Excellent Stay-ability: Features unique rheological properties that limit its flow beyond a target interface once assembled. This flow characteristic distinguishes it from lower viscosity thermal compounds, and provides greater control for applications requiring a thicker thermal compound layer or greater precision when dispensing compound between surface interfaces.
- Thermal Stability: Delivers consistent performance and reliability under high temperatures.
- Good Processability: Offers low volatile content versus competitive thermal compounds, allowing for more consistent rheology, application repeatability, and easier screen printing overall.
Summary
- Characteristics:Thermally Grease
- Market application:Consumer Products
- Market application 2:General Industry
- Color:Gray
- Brands:DOWSIL™
Specifications
- Appearance:Gray
- Viscosity(mPa.s ):Thixotropic
- Storage condition:25°C(77°F)
- Package:2g
- Application description:Suitable forLEDLighting、DT、NB、VGA、IPC、CPU、GPU、IC、Chipset
- Mix ratio:One Part
- Specific Gravity(g/cm3):2.6
- Thermal Conductivity(Watts/meter℃):5
- Thermal Resistance(°C,°C/W.)at40Psi:0.05
Characteristics: |
Thermally Grease |
Market application: |
Consumer Products |
Market application 2: |
General Industry |
Color: |
Gray |
Compliance: |
No |
Brands: |
DOWSIL™ |